Version:
Description:
Resinoid-bonded diamond grinding discs are often used for grinding tungsten carbide or HSS tools, as well as other production grinding processes. They are used in both wet and dry grinding. Phenolic resin bond for high-performance dry grinding. The PHT bond is designed for dry grinding and allows cool grinding, even without coolant.
Feature:
- Shape: 12A2/45°
- Version: PHT
- Width, abrasive belt: 10 mm
- Dia. hole: 20 mm
- Dia. external, metric: 125 mm
- Grit size: D 64
- Height, coating: 2 mm
- Angle: 45 °
Advantage:
- The characteristics of the resinoid bond can be optimally adjusted to the application.
- Easy to dress.
Application:
- Recommendations for use: A larger diameter D allows greater economic efficiency thanks to the improved thermal and kinematic conditions. Always select a coating width, W or U, that is narrower than the workpiece to be ground. If possible, wet grinding is to be preferred to dry grinding. This reduces tool wear and the risk of thermal damage to the workpiece. Bonds that are designed for dry grinding may, in exceptional circumstances, also be used for wet grinding. A greater abrasive coating thickness, X, affects the material cost for diamond and the bond. It has only little influence on production costs, however. A greater abrasive coating thickness, X, is therefore generally more economical.
- Applications: Finishing; Sharpening; Working on edges
- Drive types: Tool machine
Material:
- Materials that can be worked:
- Tungsten carbide
- Materials that can be worked: Tungsten carbide
Supplied with:
- Customer-specific tool solutions are available on request.