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Vaše materiálové číslo:
EAN / GTIN:
Číslo výrobce:
Vysokoteplotní polyimidová páska 3M™ 5413, zlatá, 50,8 mm x 33 m, 68,58 µm
Artiklové číslo: 7000148440
Vaše materiálové číslo:
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InformaceÚdaje o výrobku
Identifikační čísla a klasifikace
| Katalogové číslo | 7000148440 | |
| EAN / GTIN | 50021200161754 | |
| Číslo výrobce | 7000148440 | |
| L-číslo | L01310 98 |
Popis
Provedení:
Product Colour: Amber
Choose from a range of different sizes
Overall Length: 33 m
Overall Width: 50.8 mm
Reduce silicone contamination risk with non-silicone adhesive formulation
Choose from a range of different sizes
Overall Length: 33 m
Overall Width: 50.8 mm
Reduce silicone contamination risk with non-silicone adhesive formulation
Popis:
Vysokoteplotní polyimidová páska 3M™ 5413 se skládá z polyimidové fólie se silikonovým lepidlem. Tato hnědá páska má tloušťku 68,58 µm a lze ji použít k pokrytí desek s plošnými spoji během pájení a pro další aplikace při nízkých a vysokých teplotách v rozmezí -73 °C až 260 °C.
Charakteristika:
The DuPont™ Kapton® polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
Is dimensionally stable at high temperatures, which prevents rework, enabling high productivity
Is flame retardant, chemical and radiation resistant which protects surfaces to help reduce replacement costs
The silicone adhesive's high temperature performance reduces adhesive transfer which helps to eliminate cleaning, enabling high productivity
Available on cardboard or polyethyelene core
Is dimensionally stable at high temperatures, which prevents rework, enabling high productivity
Is flame retardant, chemical and radiation resistant which protects surfaces to help reduce replacement costs
The silicone adhesive's high temperature performance reduces adhesive transfer which helps to eliminate cleaning, enabling high productivity
Available on cardboard or polyethyelene core
Poznámka:
For PCB solder masking and other high temperature applications within a range of -73 °C to 260 °C
Use for masking protection of gold fingers of printed circuit boards during wave solder or solder dip process
Release surface in fabrication of parts cured at elevated temperature
Use for masking protection of gold fingers of printed circuit boards during wave solder or solder dip process
Release surface in fabrication of parts cured at elevated temperature